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AI Automated
Overview
Overview
An AI-powered optical inspection system designed for electronics manufacturing, semiconductor-related components, and other visually intensive inspection workflows.
Built on Memorence AI’s continuously learnable vision platform, this system digitizes and automates complex manual inspection processes while remaining adaptable to different products, defect types, and production environments.
Unlike traditional rule-based AOI systems, inspection logic and criteria are software-defined and continuously updatable through learning workflows in Memorence Suite.
Key Capabilities
Key Capabilities
Line-scan based high-resolution visual inspection
AI-driven defect detection and verification, adaptable to new products and defect patterns
Instant and continual learning, enabling rapid updates without long retraining cycles
Human-in-the-loop inspection workflows for review, feedback, and traceability
Designed for electronics, PCBA-DIP, semiconductor-related components, and other visually intensive applications
Industrial-grade mechanical design suitable for real-world production environments
Fully Integrated Inspection Workflow
Fully Integrated Inspection Workflow
The AI Automated Optical Inspection Machine is delivered as a fully integrated system, combining:
Industrial-grade inspection hardware
Edge AI computing for real-time inference
Memorence Suite software for AI learning, deployment, and lifecycle management
Inspection logic, defect definitions, and decision thresholds are not fixed.
They can be updated, optimized, and expanded through software—without changing hardware.
This system is fully integrated with Memorence Suite, providing:
AI model update
Enables rapid adaptation to new defect types via instant learning
Inspection result visualization and review
Continuous improvement through production feedback
Traceability and inspection history management
Inspection items are defined through learning, not hard-coded rules, enabling fast adaptation to product changes and evolving quality requirements.
System Specifications (Overview)
System Specifications (Overview)
Imaging & Inspection
Imaging & Inspection
Scanning Method : Line-scan imaging
Inspection Resolution : 50 μm / pixel (Higher resolution options available)
Scanning Orientation : Single-side (Configurable based on application)
Recommended / Max Inspection Width : 380 / 400 mm (Higher width options available)
Recommended / Max Inspection Depth : 480 / 500 mm (Higher depth options available)
Lighting : Integrated single-side illumination, adjustable brightness (Dual-side configuration available)
Mechanical Dimensions (Standard Single-side Configuration)
Mechanical Dimensions (Standard Single-side Configuration)
Maximum Length : 1600 mm
Maximum Width : 800 mm
Maximum Height (with tower light) : 2600 mm
Conveyor Height : 900 ± 20 mm (adjustable)
System & Power
System & Power
Tower Light : Adjustable orientation (vertical or horizontal)
Axis Configuration : Single-axis
Power Supply : 110V / 220V
Customization & Deployment
Customization & Deployment
Optical configuration, inspection area, and mechanical layout can be customized based on production requirements
Supports integration with existing production lines and enterprise systems
*Detailed specifications and configuration options are available upon request
Mechanical Safety & Operator Protection
Mechanical Safety & Operator Protection
The inspection system incorporates built-in mechanical safety mechanisms to protect operators during operation.
The moving platform is designed with resistance and force-based protection. When abnormal resistance exceeding a predefined threshold is detected, the system automatically stops movement to prevent hand trapping, pinching, or mechanical obstruction.
This safety design reduces the risk of injury caused by unexpected contact or obstruction during inspection workflows and supports safe operation in industrial environments.
Typical Applications
Typical Applications
PCBA-DIP inspection
Electronics assembly verification
Semiconductor-related component inspection
Other visually intensive inspection and quality assurance workflows
Sample Applications
Sample Applications
PCBA-DIP
Chip
Text
Electronics components
Shipping & Deployment
Shipping & Deployment
Our hardware systems are designed for deployment in global industrial environments and can be shipped to major regions worldwide.
International shipping and deployment configurations may vary depending on destination country, system configuration, and local regulatory requirements.
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